 The new Linea HS 9K pixel Time Delay Integration camera from Teledyne Dalsa features a Backside Illuminated sensor (BSI) that is sensitive in both the visible and near ultraviolet spectrum's. The sensor is designed with a 5x5μm pixel size, with 192x TDI stages and delivers a maximum line rate of 400 kHz aggregate. The new Linea HS 9K camera uses Teledyne Dalsa’s charge-domain CMOS TDI sensor and offers advanced capabilities including mono, mono High Dynamic Range, colour, multifield, and super resolution imaging.
The Linea HS TDI family is a leading product series for high-speed and high-sensitivity imaging. Its multi-array charge-domain CMOS TDI technology accumulates charge over the multiple TDI stages to produce an extremely sensitive image for very high-speed short-exposure applications or in light starved conditions.
The Linea HS camera uses a Camera Link HS data interface that delivers high data throughput in a single cable. The active optical cable (AOC) interface enables longer cable lengths eliminates the need for repeaters, improves data reliability, and reduces system costs.
The HL-HM-09K40H-00-B is very well suited to both near ultraviolet (NUV) applications and visible applications like packaging inspection, photoluminescence, and life science imaging.
Backside Illumination:
Compared with traditional frontside illuminated (FSI) sensors, the BSI model significantly improves light sensitivity and quantum efficiency in ultraviolet and visible region and boosts signal-to-noise ratio for imaging applications in this wavelength range. This is because circuitry and wires are effectively moved out of the way by being located on the backside of the sensor.
Time Delay Integration:
TDI is a method of line scanning which provides increased responsivity when compared with other video scanning methods. TDI allows improved scanning speeds in low light or allows reduced lighting levels (and costs) at conventional speeds. TDI line scanners are typically suited to tasks like wafer inspection, PCB inspection, and LCD panel inspection and much more.
TDI is based on the concept of collecting multiple exposures of the same (moving) object, effectively increasing the integration time available to collect incident light. The object motion must be synchronized with the exposures to ensure a crisp image.
| Features |
|
| • Multi-array charge-domain CMOS TDI BSI sensor with high QE >90% |
| • Mono/HDR modes |
| • High speed 400kHz max line rate |
| • High sensitivity, in particular, for near UV/blue wavelengths |
| • High resolution 9k/5um pixels |
| • Next generation Camera Link HS interface with field proven data reliability |
| • Support active optical cables (AOCs) for extended cable lengths to 100M |
| Applications |
•
Packaging inspection |
• Digital pathology |
•
Life Sciences |
•
PCB inspection |
• Food inspection |
• Gene sequencing |
| • General machine vision |
| • Semiconductor wafer inspection |
|
Specifications |
HL-HM-09K40H-00-B |
| Sensor type |
Multi-array charge-domain CMOS TDI BSI |
| Resolution |
9,216 x (128+64) pixels |
| Pixel size |
5x5 μm |
| Peak responsivity |
780 DN8/(nj/cm2) @ 1x gain in 8 bit (main array) |
| Max line rate |
400 kHz (mono mode)
200 kHz x 2 (HDR mode) |
| Bit depth |
8 or 12 bit selectable |
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Need a price or more application information? Please
email Adept Turnkey or call our offices
Adept Turnkey Pty Ltd are "The Machine Vision and Imaging Specialists" and distributor
of Teledyne Dalsa products in Australia and New Zealand. To find out more about the Linea HS or any Teledyne Dalsa product, please call Adept Turnkey at Perth (08) 9242 5411
/ Sydney (02) 9905 5551 / Melbourne (03) 9384 1775 or contact
us online. |
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